7nm

As part of SiFive’s announcements today, along with enabling SiFive IP on Intel’s Foundry Service offerings, Intel will be creating its own RISC-V development platform using its 7nm process technology. This platform, called Horse Creek, will feature several of SiFive’s new Performance P550 cores also being announced today, and will be paired with Intel’s DDR and PCIe IP technology.

Intel Licenses SiFive’s Portfolio for Intel Foundry Services on 7nm

Today’s announcement from SiFive comes in two parts; this part is significant as it recognizes that Intel will be enabling SiFive’s IP portfolio on its 7nm manufacturing process for...

2 by Dr. Ian Cutress yesterday

An AnandTech Interview with TSMC: Dr. Kevin Zhang and Dr. Maria Marced

In the past week, TSMC ran its 2021 Technology Symposium, covering its latest developments in process node technology designed to improve the performance, costs, and capabilities for its customers...

19 by Dr. Ian Cutress on 6/8/2021

AMD Ryzen 5000G: Zen 3 APUs for Desktop Coming August 5th

Back in April of this year, AMD announced its new series of Ryzen 5000G processors with integrated graphics. These processors were an upgrade over the previous generation of 4000G...

35 by Dr. Ian Cutress on 5/31/2021

TSMC Q1 2021 Process Node Revenue: More 7nm, No More 20nm

This week TSMC has disclosed its full quarterly financial results for Q1 2021. In those results the company often explains where the revenue demand is for its technologies, and...

40 by Dr. Ian Cutress on 4/15/2021

AMD Ryzen 5000G APUs: OEM Only For Now, Full Release Later This Year

With the high demand for semiconductors causing most companies to focus on their high margin, high profitability components, I wasn’t expecting to see many launches of low-to-mid range hardware...

67 by Dr. Ian Cutress on 4/13/2021

Intel to Revive ‘Tick-Tock’ Model, Unquestioned CPU Leadership Performance in 2024/2025

As part of today’s announcements, during Intel’s Q&A session after the prepared remarks, CEO Pat Gelsinger explained how Intel is going to revive its fortunes when it comes to...

110 by Dr. Ian Cutress on 3/23/2021

Intel’s New IDM 2.0 Strategy: $20b for Two Fabs, Meteor Lake 7nm Tiles, New Foundry Services, IBM Collaboration, Return of IDF

The new CEO of Intel, Pat Gelsinger, has today outlined his vision for Intel over the coming years. During an online presentation entitled ‘Intel Unleashed: Engineering The Future’, Pat...

159 by Dr. Ian Cutress on 3/23/2021

Intel CEO Pat Gelsinger To Host Webcast About Intel’s Future On March 23rd

Intel today has announced that the company will be holding an event on March 23rd to discuss the future of engineering at the company. Dubbed “Intel Unleashed: Engineering the...

33 by Ryan Smith on 3/17/2021

Xbox Series X SoC: Power, Thermal, and Yield Tradeoffs

This week at ISSCC (International Solid State Circuits Conference), Microsoft presented a talk titled ‘Xbox Series X SoC: A Next Generation Gaming Console’, with hardware engineer Paul Paternoster presenting...

82 by Dr. Ian Cutress on 2/15/2021

AMD Reports Q4 2020 Earnings: Analyst Q&A Transcript

At the end of every financial call, invited financial analysts have an opportunity to probe the key members of the company on the numbers, as well as future products...

11 by Dr. Ian Cutress on 1/26/2021

AMD Zen 3: An AnandTech Interview with CTO Mark Papermaster

The announcement of the new Ryzen 5000 processors, built on AMD’s Zen 3 microarchitecture, has caused waves of excitement and questions as to the performance. The launch of the...

202 by Dr. Ian Cutress on 10/16/2020

TSMC Updates on Node Availability Beyond Logic: Analog, HV, Sensors, RF

Most of the time when we speak about semiconductor processes, we are focused on the leading edge of what is possible. Almost exclusively that leading edge is designed for...

4 by Dr. Ian Cutress on 8/25/2020

Intel’s Future 7nm FPGAs To Use Foveros 3D Stacking

One of the main battlegrounds of future leading-edge semiconductor products will be in the packaging technology: being able to integrate multiple elements of silicon onto the same package with...

11 by Dr. Ian Cutress on 8/21/2020

Intel Reorganizes In Wake of 7nm Woes; Chief Engineering Officer Murthy Renduchintala To Depart

Coming in the wake of last week’s disclosure that their 7nm yields are roughly a full year behind schedule, Intel this afternoon has announced that they are reorganizing the...

141 by Ryan Smith on 7/27/2020

Intel 7nm Delayed By 6 Months; Company to Take “Pragmatic” Approach in Using Third-Party Fabs

While today second quarter earnings report from Intel represented a high-water mark for the company amid booming sales and revenues, unfortunately not everything disclosed today was good news from...

208 by Ryan Smith on 7/23/2020

AMD Succeeds in its 25x20 Goal: Renoir Crosses the Line in 2020

One of the stories bubbling away in the background of the industry is the AMD self-imposed ‘25x20’ goal. Starting with performance in 2014, AMD committed to itself, to customers...

83 by Dr. Ian Cutress on 6/25/2020

Ampere’s Product List: 80 Cores, up to 3.3 GHz at 250 W; 128 Core in Q4

With the advent of higher performance Arm based cloud computing, a lot of focus is being put on what the various competitors can do in this space. We’ve covered...

19 by Dr. Ian Cutress on 6/23/2020

New #1 Supercomputer: Fugaku in Japan, with A64FX, take Arm to the Top with 415 PetaFLOPs

High performance computing is now at a point in its existence where to be the number one, you need very powerful, very efficient hardware, lots of it, and lots...

46 by Dr. Ian Cutress on 6/22/2020

Intel to use Nanowire/Nanoribbon Transistors in Volume ‘in Five Years’

This year, at the international VLSI conference, Intel’s CTO Mike Mayberry gave one of the plenary presentations, which this year was titled ‘The Future of Compute’. Within the presentation...

14 by Dr. Ian Cutress on 6/22/2020

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