FOVEROS

In today’s Intel Accelerated event, the company is driving a stake into the ground regarding where it wants to be by 2025. CEO Pat Gelsinger earlier this year stated that Intel would be returning to product leadership in 2025, but hasn’t yet explained how this is coming about – that is until today, where Intel has disclosed its roadmap for its next five generations of process node technology leading to 2025. Intel believes it can follow an aggressive strategy to match and pass its foundry rivals, while at the same time developing new packaging offerings and starting a foundry business for external customers. On top of all this, Intel has renamed its process nodes.

Intel to Invest $3.5 Billion USD into Foveros and EMIB Production in Rio Rancho

At a news conference today, Intel has announced that its Rio Rancho campus in New Mexico will be getting an investment of $3.5 billion USD for an expansion of...

20 by Dr. Ian Cutress on 5/3/2021

3DFabric: The Home for TSMC’s 2.5D and 3D Stacking Roadmap

Interposers. EMIB. Foveros. Die-to-die stacking. ODI. AIB.TSVs. All these words and acronyms have one overriding feature – they are all involved in how two bits of silicon physically connect...

15 by Dr. Ian Cutress on 9/2/2020

Intel’s Future 7nm FPGAs To Use Foveros 3D Stacking

One of the main battlegrounds of future leading-edge semiconductor products will be in the packaging technology: being able to integrate multiple elements of silicon onto the same package with...

11 by Dr. Ian Cutress on 8/21/2020

Intel Next-Gen 10-micron Stacking: Going 3D Beyond Foveros

One of the issues facing next-generation 3D stacking of chips is how to increase the density of the die-to-die interface. More connections means better data throughput, reducing latency and...

32 by Dr. Ian Cutress on 8/14/2020

The Intel Lakefield Deep Dive: Everything To Know About the First x86 Hybrid CPU

For the past eighteen months, Intel has paraded its new ‘Lakefield’ processor design around the press and the public as a paragon of new processor innovation. Inside, Intel pairs...

225 by Dr. Ian Cutress on 7/2/2020

Intel Discloses Lakefield CPUs Specifications: 64 Execution Units, up to 3.0 GHz, 7 W

Over the past 12 months, Intel has slowly started to disclose information about its first hybrid x86 platform, Lakefield. This new processor combines one ‘big’ CPU core with four...

79 by Dr. Ian Cutress on 6/10/2020

Lenovo’s ThinkPad X1 Fold: Combining Foldable Displays, 5G and Lakefield into a… Laptop?

In 2019 we were exposed to the first foldable display smartphones and wearables, with the Samsung Galaxy Fold, Huawei Mate X, and Xiaomi Mi Mix all demonstrating various themes...

17 by Dr. Ian Cutress on 1/6/2020

An Interconnected Interview with Intel’s Ramune Nagisetty: A Future with Foveros

I’ve constantly stated for the last two years that the next battleground in performance for the semiconductor market is going to be in the interconnect – whether we’re speaking...

19 by Dr. Ian Cutress on 1/3/2020

Intel: Lakefield in 2020, Possible 5G on Foveros

At the IEEE International Electron Devices Meeting (IEDM) 2019, Intel had two package integration presentations, one on its Omni-Directional Interconnect and one on its 3D stacking Foveros technology. In...

37 by Dr. Ian Cutress on 12/11/2019

Intel’s Xe for HPC: Ponte Vecchio with Chiplets, EMIB, and Foveros on 7nm, Coming 2021

Today is Intel’s pre-SC19 HPC Devcon event, and with Raja Koduri on stage, the company has given a small glimpse into its high-performance compute accelerator strategy for 2021. Intel...

16 by Dr. Ian Cutress on 11/17/2019

Hot Chips 31 Live Blogs: Intel Lakefield and Foveros

One of the interesting developments in packaging technology in recent memory is the 3D stacking of Intel's new Foveros technology. The first chip to use this packaging technology is...

31 by Dr. Ian Cutress on 8/20/2019

Intel Details Manufacturing through 2023: 7nm, 7+, 7++, with Next Gen Packaging

At Intel's Investor Day today, CEO Bob Swan and Murthy Renduchintala spoke to the ability of the company with respect to its manufacturing capabilities. Intel has historically been strong...

237 by Ian Cutress & Anton Shilov on 5/8/2019

Intel's Interconnected Future: Combining Chiplets, EMIB, and Foveros

While Intel works on getting its main manufacturing process technology on track, it is spending just as much time and effort in researching and developing the rest of the...

117 by Ian Cutress on 4/17/2019

CES 2019 Quick Bytes: Intel’s 10nm Hybrid x86 Foveros Chip is Called Lakefield

At Intel’s Architecture Day, the company showed off a new stacking technology called ‘Foveros’, which is designed to allows the company to make smaller chips. The idea behind Foveros...

10 by Ian Cutress on 1/7/2019

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