Alongside AMD’s widely expected client product announcements this evening for desktop CPUs, mobile CPUs, and mobile GPUs, AMD’s CEO Dr. Lisa Su also had a surprise up her sleeve for the large crowd gathered for her prime CES keynote: a sneak peak at MI300, AMD’s next-generation data center APU that is currently under development. With silicon literally in hand, the quick teaser laid out the basic specifications of the part, along with reiterating AMD’s intentions of taking leadership in the HPC market. First unveiled by AMD during their 2022 Financial Analyst Day back in June of 2022, MI300 is AMD’s first shot at building a true data center/HPC-class APU, combining the best of AMD’s CPU and GPU technologies. As was laid out at the time...
AMD: Combining CDNA 3 and Zen 4 for MI300 Data Center APU in 2023
Alongside their Zen CPU architecture and RDNA client GPU architecture updates, AMD this afternoon is also updating their roadmap for their CDNA server GPU architecture and related Instinct products...16 by Ryan Smith on 6/9/2022